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Dr. Patterson will review trends in HPC and how these effect machine design and the data center. The talk will focus on directions for power, packaging, and cooling and activities that will shape future data centers. The challenges of building and planning data centers that must last for several generations of computing will be highlighted. Power architecture, air vs liquid-cooling, and metrics to track it all will be discussed.
About the speaker
Michael K. Patterson is a Senior Principal Engineer in the Technical Computing Group - Systems Architecture & Pathfinding at the Intel Corporation, in Dupont, Washington, where he works in the power, thermal, and energy-efficient-performance areas of High Performance Computing. The work covers silicon level activity, through platform and rack-level solutions, and on up to interface with Data Center power and cooling technologies. He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont. His current technical interests include super-computer architecture, server power and thermal management technologies, and high density data center concepts. He has been with Intel for 21 years. He is a registered Professional Engineer. He is a Fellow of the ASME. He is a member of ASHRAE, and served as the Research Chair for ASHRAE TC9.9, Mission Critical Facilities. He also represents Intel in a number of Green Grid Activities, most notably as the first chair of the Data Center Technology and Strategy Working Group. Dr. Patterson has been certified by the US DOE as a DCEP.
Organised by: Maria Girone and Miguel Angel Marquina - IT Department
CERN Computing Seminars and Colloquia